- Cooling the vapor, such as sweat, can reduce energy use in data centers
- New fiber membrane heat handles heat with zero -added energy use
- Researchers re -developed the filtration content to cool down
As AI and cloud computing increases, the increasing demand for data processing is increasing heat production, which is already about 40 % of the data center’s energy use already and is predicted by more than double worldwide by 2030.
Researchers from the University of California San Diego have developed a new cooling technology that imitates the method of managing the body’s body temperature… through sweat.
The passive system removes heat from electronics using vapors, which offers a potential alternative to traditional cooling methods in data centers and other high -power computing environments.
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To find a “sweet spot”
The main fiber of this system is the membrane that contains a network of small, interconnected piercings that uses a capacity process to pull the cooling liquid on the surface.
As the liquid becomes a vapor, it effectively removes heat without the need for extra energy.
“Compared to traditional air or liquid cooling, vapors can eliminate heat flow by using traditional air or liquid cooling,” said Professor Rankin Chen in the Department of Mechanical and Aerospace Engineering in UC San Diego. Chen performed Professors Shengkiang and led the project with Abhishek Saha.
This research appeared in the journal JouleExplaining how Chen’s team, including PhD. Student Tianshi Feng and Post Documentary Researcher UPE tested the membrane in variable heat conditions.
It handled more than 800 watts per square centimeter, which is a record of this type of cooling system. He also performed permanently in several hours.
Traditional unsafe membranes often fail because of or boiling. Chen explained that the team found a “sweet place” with the membrane size and structure of the membrane.
“This fiber membranes were actually designed for filtration, and no one had previously discovered their use in the vapor,” Chen said. “We acknowledged that their unique structural features – integrated holes and only right -wit sizes – can make them ideal ideal to cool effective vapors. We were surprised that, with the right mechanical reinforcement, they not only fought high heat flow – they performed very well.”
Researchers believe that the membrane is still moving below its full potential.
Now they are improving the design and working on ways to integrate it into cold plates, used to cool flat devices such as CPUs and GPUs.
The group is also preparing to make technology commercial through startups. Their purpose is to provide scaleable, low -energy cooling solutions as global data demand is increasing.
By Tech Explore
