Well, a year ago, today we told you about Huawei and SMIC’s 3NM chips. A patent filed by Huawei discusses how the latter and the world’s third largest foundry, SMIC, will use the self -connected square patterning (SAQP) lithography to replace the highly ultra -violet lithography machines in China. As a result, Huawei will go one step closer to meet with the advanced Samski by the TSMC and the Samsung Foundry. Today, a year ahead and a new report outside Taiwan claims that Huawei has started R&D work on the method of producing 3NM chips for the domestic chip industry. Huawei is allegedly pleased with the method used by SMIC that is used to strengthen the 5NM Karen X90 chip to strengthen the Met Book Pro Laptop. The Foundry speculated that these old deep ultra -welfare lithography (DUV) machines were used, which was purchased by SMIC, before the American chip was banned, so that the sauce could be made.
If Huawei and SMIC DVs continue to rely on machines, the use of numerous impression on silicon waifers (double, triple, or even square patterns) will be needed for lithography, which pushes the cost of making chips, especially as a reduction in production. The use of numerous impressions results in the transfer of circuitry samples to silicon wafers that are less precise and faster because such designs use lithography machines that prevent China from sending. This reduces the production of foundry and increases the cost of chips made using this procedure.
5nm Caren was built by TSMC in 2020 before 9000 US sanctions
Huawei 3NM chips will use Gate All-As Pass (GAA) transistors that only use the Samsung Foundry on 3NM. The GAA Transists are surrounded by the gate around the four sides of the channel, which has reduced the current leak and improves the drive current. The result is a more powerful chip with better performance and energy efficiency. Huawei is also considered to tinker with normal silicon design and choose the use of “two -dimensional” materials, which is believed to improve chip efficiency and low energy consumption.
In addition to these changes, it is believed that Huawei is developing a 3NM node that uses carbon nanotobes instead of silicon transistors. The report calls for Huawei to complete the design phase for its 3NM node next year, also known as the “tape out” phase. On this occasion, Huawei sends a full and certified design to the SMIC, which can prepare the foundry to prepare the chips using a 3NM node.
Huawei was already receiving 5NM chips from TSMC in 2020 when US sanctions began to prevent Huawei from getting modern chips from founders like TSMC. Huawei was forced to use 4G Snapdragon application processors made by Qualcomm before using 7nm Caren 9000s to strengthen fellow 60 Pro. This astonishing development brought 5G back to Huawei Handsets.
Read the latest from Alan Fredman
