- Apollo 2 switch supports General 6.2 and CXL 3.1 within the same hybrid chip
- Xconn wants to renew the boundaries of bandout, but real world results remain completely unstable
- Intel and Xin are cooperating to test complete stack compatibility in PCIE -based ecosystem
Xconn Technologies is preparing to show that it has been fully integrated in the future of the memory and storage (FMS25) event, from the end to the end of the PCI General 6.2 and CXL 3.1 solution.
The company is positioned as an important step in meeting the launch of AI and data center workload performance requirements.
However, like any early -stage technology demo, real -world scale and reliability are still open questions.
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Hybrid switch with theoretical flexibility
The company’s Apollo 2 switch will be the main focus of its unveiling – which has been marketing as the first hybrid switch of the industry to support both PCIE gene 6.2 and CXL 3.1 inside the same chip, it is said that it can facilitate mutual integrated designs and increase the scale.
“The Xin market is excited to bring the PCI General 6.2 and CXL 3.1 switches, which is now available,” said Jerry Fan, CEO of Exxon Technologies, which is now available.
“Since this industry is faster towards more memory focus and performance architecture, our commitment is to empower consumers with the best class.”
The purpose of these benefits is to reduce the complexity of the data centers while enabling wider construction flexibility.
Although there is a technically promising, the real advantage of such integration depends on the performance results under the workload of the production grade.
Xconn’s cooperation with Intel is also being positioned as a major development, as according to Intel’s senior colleague Ronak Singhal, partnerships will help ensure that both software and hardware components are easily interacts, “which are” solved from strong end to end. “
Companies expect the effort to promote a co -operation environment for PCIE and CXL technologies.
Nevertheless, past experiences in the industry show that successful verification often takes time and multiple demo cycles.
The incoming demo will display low delays, high bandwidth switching, which will highlight the preparation of infrastructure for applications such as AI/ML model training, cloud computing, and composable infrastructure.
Xconn’s booth will be allegedly displayed fully -based setup, but until the benchmark is issued, it is difficult to determine how much the current PCIE GEN can improve compared to 5 deployments.
Exxon also contributed with scalflux to improve CXL 3.1 interplasticity for AI and Cloud Infrastructure.
Although it indicates speed, it is not confirmed to what extent the solution is to solve today’s architecture with the type of work burden.
High -speed storage implications are important if technology provides.
With the biggest SSD capabilities and the increasing demand for the fastest SSD performance, the PCI can support the rapid data transfer between the general 6 storage devices and processing units.
Nevertheless, these theoretical benefits should be subjected to doubts until field data confirm its effects.
Exxon’s demo can well mark the start of the next chapter in AI hardware. But for now, this is a preview, no evidence.
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